Socket having means of no-load engaging with and releasing from

Geometrical instruments

Patent

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Details

H01R 1354

Patent

active

044127138

ABSTRACT:
A socket for an IC package includes a base plate normally accommodating two rows of contacts and a movable plate supporting at least one IC package with the lead wires of the IC package passing through rows of through openings. The movable plate is movable between a lead wire release position and a contact engaging position in a horizontal lateral direction which is perpendicular to the direction of the length of the rows of contacts. All the contacts are opened in the lateral direction. Guides on the plates limit the movement of the movable plate to only the lateral direction. Further, the movable plate urges a side surface of the package body so that the throughopenings can be wide enough to accommodate production variables of the package.

REFERENCES:
patent: 4062617 (1977-12-01), Johnson

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