Socket having a structure for grasping solder balls

Details Socket having a structure for grasping solder balls Socket having a structure for grasping solder balls

2006-12-12

2006-12-12

Paumen, Gary F. (Department: 2833)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Distinct contact secured to panel circuit

Reexamination Certificate

active

07147489

ABSTRACT:
A socket having a structure for grasping solder balls is disclosed. A grasping hole is laterally defined in the solder joint of each terminal of the socket, and a stop wall is formed at the dielectric housing spaced from the grasping hole at a proper distance. The solder ball is secured between the stop wall and the solder joint with a portion of the solder ball being received in the grasping hole. The dimension of the grasping hole is slightly larger than that of a side surface of the solder ball received in the grasping hole, whereby the solder ball is freely movable up and down in the grasping hole of the solder joint. Therefore, when the socket is soldered to the circuit board, the solder balls can automatically fully contact the surface of the circuit board.

REFERENCES:
patent: 6056558 (2000-05-01), Lin et al.
patent: 6533590 (2003-03-01), Lee et al.
patent: 6570280 (2003-05-01), Takahashi
patent: 6572397 (2003-06-01), Ju
patent: 6702594 (2004-03-01), Lee et al.
patent: 6755667 (2004-06-01), Lin
patent: 6783375 (2004-08-01), He
patent: 6857184 (2005-02-01), Ju

Affiliated with

Also associated with

Rating

Socket having a structure for grasping solder balls does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Socket having a structure for grasping solder balls, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Socket having a structure for grasping solder balls will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3699621