Socket for testing semiconductor package

Details Socket for testing semiconductor package Socket for testing semiconductor package

2011-07-12

2011-07-12

Vu, Hien (Department: 2839)

Electrical connectors

Coupling part having handle or means to move contact...

C439S331000

Reexamination Certificate

active

07976325

ABSTRACT:
A socket adapted for electrically connecting a semiconductor package to a printed circuit board, includes a main body defining a number of contact passageways and a plurality of contacts received in the contact passageways of the main body. Each contact has a base portion, a first contacting portion and a second contacting portion upwardly extending from the base portion, and a spring arm bent from a bottom edge of the base portion. The spring arm extends substantially in a horizontal direction and is bent downwardly at a free end thereof to form a tail. The spring arm can deform to provide an elastic force for the tail to press against the printed circuit board.

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patent: 5713751 (1998-02-01), Fukunaga
patent: 6109944 (2000-08-01), Takeyama
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patent: 6540537 (2003-04-01), Kawamura et al.
patent: 7775821 (2010-08-01), Hsu et al.
patent: 2001/0014550 (2001-08-01), Yamada
patent: 201054407 (2008-04-01), None
patent: 1091628 (2001-10-01), None

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