Socket for stacking integrated circuit packages

Details Socket for stacking integrated circuit packages Socket for stacking integrated circuit packages

1985-12-13

1987-09-29

Crane, Daniel C.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439 70, H01R 1300

Patent

active

046965254

ABSTRACT:
A socket for stacking and interconnecting corresponding leads of two integrated circuit packages having the contacts stamped and formed in a lead frame configuration with a dielectric body molded over a portion of the terminal ends. Two contact halves are sheared from the opposite end of the terminal, one contact formed upwardly while the second contact is formed downwardly. Integrated circuit package leads can be selectively commoned by jumpering the terminal ends prior to molding the body.

REFERENCES:
patent: 3789341 (1974-01-01), Dalmasso
patent: 4364620 (1982-12-01), Mulholland et al.
patent: 4406508 (1983-09-01), Sadigh-Behzadi
patent: 4471158 (1984-09-01), Roberts
patent: 4588239 (1986-05-01), Venaleck

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