Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1993-03-26
1994-07-19
Nguyen, Khiem
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 83, H01R 909
Patent
active
053303598
ABSTRACT:
A socket supports a plurality of integrated circuit chips in a vertical stack and interconnects the chips to circuit traces on a substrate. The socket includes a dielectric base having a top surface and a bottom surface. The base holds a plurality of electrical contacts. Each of the contacts has a foot portion which extends below the bottom surface for electrical connection with one of the traces, and a main body portion which extends above the top surface for electrical connection with respective electrical leads extending from the chips. Each of the main body portions has a solder coating on one side. The contacts are arranged such that the solder coated sides abut their respective leads, and the contacts are electrically connectable with the leads by reflow of the solder coating.
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IBM Technical Disclosure, vol. 14, No. 10, Mar. 1972.
Kapalka Robert J.
Nguyen Khiem
The Whitaker Corporation
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