Socket for semiconductor package

Details Socket for semiconductor package Socket for semiconductor package

2007-10-02

2007-10-02

Ta, Tho D. (Department: 2833)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C439S073000, C439S331000

Reexamination Certificate

active

10467502

ABSTRACT:
A socket (10) for a semiconductor package having a plurality of solder balls (5) at its bottom surface. The socket (10) includes a socket body having a plurality of contacts (11) arranged in a shape to correspond in arrangement to the solder balls (5) of the semiconductor package. Each of the contacts (11) has a first and second contact piece contactable with the corresponding solder ball (5) while clamping the corresponding solder ball (5) from both side. The socket (10) includes a placing plate (13) capable of moving between a first position and a second position. The first, or semiconductor placing, position is where the semiconductor package is placed on the placing plate (13) without contact of the solder balls (5) of the semiconductor package with the first and second contact pieces, and the second, or contact, position is where the solder balls (5) of the placed semiconductor package are contactable with the corresponding first and second contact pieces.

REFERENCES:
patent: 5518410 (1996-05-01), Masami
patent: 5611705 (1997-03-01), Pfaff
patent: 5807104 (1998-09-01), Ikeya et al.
patent: 6069481 (2000-05-01), Matsumura
patent: 6149449 (2000-11-01), Abe
patent: 6168449 (2001-01-01), Huang et al.
patent: 6218849 (2001-04-01), Kiyokawa
patent: 6220870 (2001-04-01), Barabi et al.
patent: 6296505 (2001-10-01), Fukunaga et al.
patent: 6439910 (2002-08-01), Hayakawa
patent: 6500017 (2002-12-01), Hayakawa
patent: 2001/0024896 (2001-09-01), Fukunaga

Affiliated with

Also associated with

Rating

Socket for semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Socket for semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Socket for semiconductor package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3891465