Electrical connectors – Coupling part with actuating means urging contact to move...
Reexamination Certificate
2007-10-09
2007-10-09
Hammond, Briggitte R. (Department: 2833)
Electrical connectors
Coupling part with actuating means urging contact to move...
C439S073000, C439S331000
Reexamination Certificate
active
11448900
ABSTRACT:
Lengths of arms of pressing members held at a lower end of an arm section of a cover member are determined in correspondence to the retention of semiconductor devices having contour dimensions different from each other, and are shorter than a length of the arm section so that part of the pressing members is projected outside through a recess of the socket body.
REFERENCES:
patent: 4715823 (1987-12-01), Ezura et al.
patent: 4887969 (1989-12-01), Abe
patent: 5249972 (1993-10-01), Walker
patent: 5301416 (1994-04-01), Foerstel
patent: 5458499 (1995-10-01), Matsuoka
patent: 5482471 (1996-01-01), Mori et al.
patent: 5493237 (1996-02-01), Volz et al.
patent: 5518410 (1996-05-01), Masami
patent: 5531608 (1996-07-01), Abe
patent: 5573427 (1996-11-01), Sagano
patent: 5807104 (1998-09-01), Ikeya et al.
patent: 5923179 (1999-07-01), Taylor
patent: 6106319 (2000-08-01), Fukunaga et al.
patent: 6149449 (2000-11-01), Abe
patent: 6155859 (2000-12-01), Choy
patent: 6213806 (2001-04-01), Choy
patent: 6243267 (2001-06-01), Chuang
patent: 6280219 (2001-08-01), Sano et al.
patent: 6280222 (2001-08-01), Walkup
patent: 6283780 (2001-09-01), Yamamoto et al.
patent: 6296505 (2001-10-01), Fukunaga et al.
patent: 6322384 (2001-11-01), Ikeya
patent: 6350138 (2002-02-01), Atobe et al.
patent: 6383002 (2002-05-01), Ohashi
patent: 6439897 (2002-08-01), Ikeya
patent: 6443741 (2002-09-01), Watanabe
patent: 6517370 (2003-02-01), Fukunaga
patent: 6739894 (2004-05-01), Ogura
patent: 6752645 (2004-06-01), Nakamura et al.
patent: 6758684 (2004-07-01), Oikawa et al.
patent: 6776641 (2004-08-01), Hachuda
patent: 0 969 710 (2000-01-01), None
patent: 0 969 711 (2000-01-01), None
patent: 1 111 724 (2001-06-01), None
patent: 62-160676 (1987-07-01), None
patent: 63-299257 (1988-12-01), None
patent: 05-029050 (1993-02-01), None
patent: 05-047445 (1993-02-01), None
patent: 05-020286 (1993-03-01), None
patent: 06-020752 (1994-01-01), None
patent: 06-020753 (1994-01-01), None
patent: 06-203936 (1994-07-01), None
patent: 06-290839 (1994-10-01), None
patent: 07-239362 (1995-09-01), None
patent: 08-046335 (1996-02-01), None
patent: 08-138812 (1996-05-01), None
patent: 09-199217 (1997-07-01), None
patent: 09-199250 (1997-07-01), None
patent: 09-211067 (1997-08-01), None
patent: 09-245920 (1997-09-01), None
patent: 10-073635 (1998-03-01), None
patent: 10-256764 (1998-09-01), None
patent: 10-302925 (1998-11-01), None
patent: 11-097818 (1999-04-01), None
patent: 11-126671 (1999-05-01), None
patent: 11-238566 (1999-08-01), None
patent: 2000-113954 (2000-04-01), None
patent: 2000-150092 (2000-05-01), None
patent: 2000-182739 (2000-06-01), None
patent: 2000-340324 (2000-12-01), None
patent: 2001-066346 (2001-03-01), None
patent: 2001-185313 (2001-07-01), None
patent: 2001-326045 (2001-11-01), None
patent: 03-257994 (2001-12-01), None
patent: 2002-063975 (2002-02-01), None
patent: 2002-202729 (2002-07-01), None
patent: 2003-007942 (2003-01-01), None
patent: 2003-123926 (2003-04-01), None
patent: 2004-014873 (2004-01-01), None
Office Action in co-pending U.S. Appl. No. 11/106,461, dated Oct. 13, 2006 Ex. Pape).
Co-Pending U.S. Appl. No. 10/735,882; Title: Socket for Semiconductor Device U.S. filed: Dec. 16, 2003.
Co-pending U.S. Appl. No. 11/106,461; Title: Semiconductor Device Socket U.S. filed: Apr. 15, 2005.
Co-Pending U.S. Appl. No. 11/212,706 Title: Method of Mounting and Demounting a Semiconductor Device, Device for Mounting and Demounting Asemiconductor Device Using the Same, and Socket for Semiconductor Device U.S. filed: Aug. 29, 2005.
Co-Pending U.S. Appl. No. 11/448,873 Title: Socket for Semiconductor Device U.S. filed: Jun. 8, 2006.
Co-Pending U.S. Appl. No. 11/448,899 Title: Socket for Semiconductor Device U.S. filed: Jun. 8, 2006.
English Translation of JP 02-665419.
English Translation of JP 60-189977.
Office Action from Japanese Patent Office corresponding to Japanese Patent Application No. 2001-171133.
Office Action from Japanese Patent Office corresponding to Japanese Patent Application No. 2001-241318.
Office Action in co-pending U.S. Appl. No. 10/153,638 dated Jun. 30, 2003 (Ex. Nasri).
Office Action in co-pending U.S. Appl. No. 10/161,641 dated May 5, 2003 (Ex. E. Leon).
Office Action in co-pending U.S. Appl. No. 10/161,641 dated Oct. 17, 2003.
Office Action in co-pending U.S. Appl. No. 10/212,875 dated Aug. 21, 2003 (Ex. C. Prasad).
Office Action in co-pending U.S. Appl. No. 10/735,882 dated May 11, 2005 (Ex. Hammond).
Office Action in co-pending U.S. Appl. No. 10/735,882 dated Nov. 3, 2005 (Ex. Hammond).
Official Action from German Patent Office for corresponding German Patent Application No. 10223502.3-55.
Official Letter from Japanese Patent Office for Japanese Patent Application No. 2001-157657 with English translation.
Official Notice of Rejection of Japanese Patent Office for Japanese Patent Application No. 2003-393067, dated Jul. 5, 2005.
Sato Masaru
Ujike Ryo
Finnegan Henderson Farabow Garrett & Dunner LLP
Hammond Briggitte R.
Yamaichi Electronics Co. Ltd.
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