Socket for semiconductor device

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C439S331000

Reexamination Certificate

active

07118386

ABSTRACT:
Lengths of arms of pressing members held at a lower end of an arm section of a cover member are determined in correspondence to the retention of semiconductor devices having contour dimensions different from each other, and are shorter than a length of the arm section so that part of the pressing members is projected outside through a recess of the socket body.

REFERENCES:
patent: 4715823 (1987-12-01), Ezura et al.
patent: 4887969 (1989-12-01), Abe
patent: 5249972 (1993-10-01), Walker
patent: 5301416 (1994-04-01), Foerstel
patent: 5458499 (1995-10-01), Matsuoka
patent: 5482471 (1996-01-01), Mori et al.
patent: 5493237 (1996-02-01), Volz et al.
patent: 5518410 (1996-05-01), Masami
patent: 5531608 (1996-07-01), Abe
patent: 5573427 (1996-11-01), Sagano
patent: 5807104 (1998-09-01), Ikeya et al.
patent: 5923179 (1999-07-01), Taylor
patent: 6106319 (2000-08-01), Fukunaga et al.
patent: 6149449 (2000-11-01), Abe
patent: 6155859 (2000-12-01), Choy
patent: 6213806 (2001-04-01), Choy
patent: 6243267 (2001-06-01), Chuang
patent: 6280219 (2001-08-01), Sano et al.
patent: 6280222 (2001-08-01), Walkup
patent: 6283780 (2001-09-01), Yamamoto et al.
patent: 6296505 (2001-10-01), Fukunaga et al.
patent: 6322384 (2001-11-01), Ikeya
patent: 6350138 (2002-02-01), Atobe et al.
patent: 6383002 (2002-05-01), Ohashi
patent: 6439897 (2002-08-01), Ikeya
patent: 6443741 (2002-09-01), Watanabe
patent: 6517370 (2003-02-01), Fukunaga
patent: 6739894 (2004-05-01), Ogura
patent: 6752645 (2004-06-01), Nakamura et al.
patent: 6758684 (2004-07-01), Oikawa et al.
patent: 6776641 (2004-08-01), Hachuda
patent: 0 069 711 (2000-01-01), None
patent: 0 969 710 (2000-01-01), None
patent: 1 111 724 (2001-06-01), None
patent: 60-189977 (1985-12-01), None
patent: 62-160676 (1987-07-01), None
patent: 63-299257 (1988-12-01), None
patent: 05-029050 (1993-02-01), None
patent: 5-047445 (1993-02-01), None
patent: 05-20286 (1993-03-01), None
patent: 6-020752 (1994-01-01), None
patent: 6-020753 (1994-01-01), None
patent: 6-203936 (1994-07-01), None
patent: 06-290839 (1994-10-01), None
patent: 7-239362 (1995-09-01), None
patent: 8-046335 (1996-02-01), None
patent: 8-138812 (1996-05-01), None
patent: 2665419 (1997-06-01), None
patent: 09-199217 (1997-07-01), None
patent: 09-199250 (1997-07-01), None
patent: 09-211067 (1997-08-01), None
patent: 9-245920 (1997-09-01), None
patent: 10-073635 (1998-03-01), None
patent: 10-256764 (1998-09-01), None
patent: 10-302925 (1998-11-01), None
patent: 11-097818 (1999-04-01), None
patent: 11-126671 (1999-05-01), None
patent: 11-238566 (1999-08-01), None
patent: 2000-113954 (2000-04-01), None
patent: 2000-150092 (2000-05-01), None
patent: 2000-182739 (2000-06-01), None
patent: 2000-340324 (2000-12-01), None
patent: 2001-066346 (2001-03-01), None
patent: 2001-185313 (2001-07-01), None
patent: 2001-326045 (2001-11-01), None
patent: 3257994 (2001-12-01), None
patent: 2002-63975 (2002-02-01), None
patent: 2002-202729 (2002-07-01), None
patent: 2003-007942 (2003-01-01), None
patent: 2003 123926 (2003-04-01), None
patent: 2004-014873 (2004-01-01), None
Official Notice of Rejection from Japanese Patent Office for Japanese Patent Application No. 2003-393067, dated Jul. 8, 2005.
Office Action from Japanese Patent Office corresponding to Japanese Patent Application No. 2001-171133.
Office Action from German Patent Office for German Patent Application No. 10223502.3-55 with English. translation.
Office Action dated Aug. 21, 2003, from USPTO for U.S. Appl. No. 10/212,875.
Notice of Allowance dated Feb. 10, 2004, from USPTO for U.S. Appl. No. 10/212,875.
Office Action dated May 5, 2003, from USPTO for U.S. Appl. No. 10/161,641.
Office Action dated Oct. 17, 2003, from USPTO for U.S. Appl. No. 10/161,641.
Notice of Allowance dated Feb. 17, 2004, from USPTO for U.S. Appl. No. 10/161,641.
Office Action dated Jun. 30, 2003, from USPTO for U.S. Appl. No. 10/153,638.
Notice of Allowance dated Oct. 15, 2003, from USPTO for U.S. Appl. No. 10/153,638.
Supplemental Notice of Allowance dated Mar. 26, 2004, from USPTO for U.S. Appl. No. 10/153,638.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Socket for semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Socket for semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Socket for semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3645097

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.