Socket for semiconductor device

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

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Details

C439S066000

Reexamination Certificate

active

06910898

ABSTRACT:
The cap body of the pressing cap has lamellar pieces for pressing portions of the substrate in the contact sheet, in which ends of the respective sides of the bare chip are positioned.

REFERENCES:
patent: 6439897 (2002-08-01), Ikeya
patent: 9-017539 (1997-01-01), None

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