Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1995-09-29
1997-11-25
Lam, Cathy F.
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
428901, 439 74, 439 75, 439 71, 361714, 361725, 257727, 257712, B32B 300, H01R 458, H05K 500, H05K 716
Patent
active
056910410
ABSTRACT:
A socket for attaching a flip chip die or ball grid array devices to a printed circuit board substrate having a pattern of solder covered lands, with resources for removing the flip chip die or ball grid array device, resources for directly aligning the solder balls of the flip chip die or ball grid array device to the printed circuit board, resources for using an interposer of dendrite coated vias or pads to electrically and physically connect the solder balls of the flip chip die or ball grid array devices to the solder deposits of the printed circuit board, resources for having the interposer reconfigure the wiring for testing or replacement purposes, resources for utilizing the flexibility and resilience of the interposer to improve dendrite connections, and resources for heat sinking the flip chip die or ball grid array device by direct thermal contact. The socket applies an evenly distributed force to connect the aligned flip chip die or ball grid array device solder ball pattern to the underlying printed circuit board solder deposit pattern through dendrite penetration of the solder using an interposer situated between and aligned to each such solder pattern.
REFERENCES:
patent: 4381131 (1983-04-01), Demnianiuk
patent: 4652973 (1987-03-01), Baker et al.
patent: 4679118 (1987-07-01), Johnson et al.
patent: 4748495 (1988-05-01), Kucharek
patent: 4759491 (1988-07-01), Fisher
patent: 4923404 (1990-05-01), Redmond et al.
patent: 4927369 (1990-05-01), Grabbe et al.
patent: 4932883 (1990-06-01), Hsia et al.
patent: 4933808 (1990-06-01), Horton et al.
patent: 4954878 (1990-09-01), Fox et al.
patent: 5123850 (1992-06-01), Elder et al.
patent: 5137461 (1992-08-01), Bindra et al.
patent: 5161983 (1992-11-01), Ohno et al.
patent: 5163837 (1992-11-01), Rowlette, Sr.
patent: 5171290 (1992-12-01), Olla et al.
patent: 5199889 (1993-04-01), McDevitt, Jr.
patent: 5207585 (1993-05-01), Byrnes et al.
patent: 5215472 (1993-06-01), DelPrete et al.
patent: 5221209 (1993-06-01), D'Amico
patent: 5232372 (1993-08-01), Bradley et al.
patent: 5237743 (1993-08-01), Busacco et al.
patent: 5248262 (1993-09-01), Busacco et al.
patent: 5258648 (1993-11-01), Lin
patent: 5280191 (1994-01-01), Chang
patent: 5302853 (1994-04-01), Volz et al.
patent: 5313097 (1994-05-01), Haj-Ali-Ahmadi
patent: 5313099 (1994-05-01), Tata et al.
patent: 5363275 (1994-11-01), Frankeny et al.
patent: 5397245 (1995-03-01), Roebuck et al.
patent: 5397919 (1995-03-01), Tata et al.
patent: 5413489 (1995-05-01), Switky
patent: 5419710 (1995-05-01), Pfaff
patent: 5451165 (1995-09-01), Cearley-Cabbiness et al.
patent: 5468157 (1995-11-01), Roebuck et al.
patent: 5468158 (1995-11-01), Roebuck et al.
patent: 5468996 (1995-11-01), Chan et al.
patent: 5477161 (1995-12-01), Kardos et al.
patent: 5493475 (1996-02-01), Lin
IBM Technical Disclosure Bulletin, vol. 37, No. 10, Oct. 1994, "Double-Sided, Replaceable, Dendrite-Plated Interposer for Connector Applications" pp. 35-36.
IBM Technical Disclosure Bulletin, vol. 36, No. 07, Jul. 1993, "Interposer for Direct Chip Attach or Surface Mount Array Devices", pp. 137-138.
Abstract, Proceedings of the Technical Conf. 1991 International Electronic Packaging Conference, Int. Electronic Packaging Conf., San Diego, CA, Sep. 1991, pp. 549-562.
Advaced Packaging, May/Jun. 1995, "Mini BGA", Chanchani et al.
1992 Circuit Components Inc., "Isocon Interconnections" features and applications.
Iicit Symposiom, San Diego, CA, International Institute of Connector and Interconnection Technology, Oct. 1991, "Compression Mount Connectors Considerations for LGA and MCM applications", Kirkman, pp. 341-347.
Circuit World, vol. 21, No. 2, 1995, "A Reliability Study of Fuzz Button Interconnects", Harris et al, pp. 12-18.
Electronic News, vol. 41, No. 2080, Aug. 1995, "BGA Production Goals to Key Smi . . . Vendors to Tackle Problems of Producing High-Volume BGAs", Levine.
1992 Proceedings of the IEEE Multi-Chip Module Conference, MCMC-92, Mar. 18-20, 1992, "Fine Pitch Pad Array Carrier Sockets for MultiChip Modules", Trent et al, pp. 40-43.
Technology Products, Cable and Connector Products, "The Right Connections".
Tecknit Interconnection Products, "Fuzz Button Board Assembly".
Frankeny Jerome Albert
Frankeny Richard Francis
Massey Danny Edward
Vanderlee Keith Allan
International Business Machines - Corporation
Lam Cathy F.
Salys Casimer K.
LandOfFree
Socket for semi-permanently connecting a solder ball grid array does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Socket for semi-permanently connecting a solder ball grid array , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Socket for semi-permanently connecting a solder ball grid array will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2105136