Socket for multi-lead integrated circuit packages

Details Socket for multi-lead integrated circuit packages Socket for multi-lead integrated circuit packages

1995-06-20

1996-06-18

Nguyen, Khiem

Electrical connectors

Electromagnetic or electrostatic shield

Multi-part shield body

439931, H01R 13648

Patent

active

055271898

ABSTRACT:
A socket and a method for making a socket for securing an integrated circuit package to a supporting structure. The integrated circuit package has a plurality of leads positioned in a geometric pattern and each lead has a predetermined impedance. The socket comprises a substrate or body having a first and second surface opposed to each other and formed of an insulative material. The socket further comprises a plurality signal path members extending from at least the first surface to the second surface. Each signal path includes a first and second end. One end of each signal path member includes a means positioned to secure a lead of an integrated circuit package and the other end is adapted to be coupled to a conductor on a printed circuit board. A metal pattern or ground plane mesh is defined on at least a surface of the substrate, and coated through holes are defined in the substrate at a predetermined distance such that the impedance of at least one signal path is controlled to match the anticipated impedance of the lead. Further, radio-frequency interference with at least one signal path is suppressed.

REFERENCES:
patent: 3034087 (1962-05-01), Bohannon, Jr.
patent: 4858313 (1989-08-01), Bowlin
patent: 4902235 (1990-02-01), Tonooka
patent: 5037332 (1991-08-01), Wilson
patent: 5044992 (1991-09-01), Dzwonczyk et al.
patent: 5076800 (1991-12-01), Milnes et al.
patent: 5102352 (1992-04-01), Arisaka
patent: 5190472 (1993-03-01), Voltz et al.
patent: 5194020 (1993-03-01), Voltz
patent: 5211567 (1993-05-01), Neumann et al.

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