Socket for mounting an IC chip package on a printed circuit boar

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

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Details

439 81, 439 83, 439828, H01R 909

Patent

active

049540882

ABSTRACT:
A socket for mounting IC chip package on a printed circuit board has an elongated socket body having a plurality of contact elements aligned along the length of the socket body for contact with corresponding one of leads extending laterally from the IC chip package. A cover frame is fitted over the socket body to press the IC chip leads against the corresponding contact elements for positive electrical connection therebetween. The socket body carries between the longitudinal ends thereof the contact elements and is engaged at the longitudinal ends with the cover frame. Each contact element is struck from a metal strip to include a base and an anchor leg extending from one end of the base to be bent into the socket body, the other end of the base extending laterally and being bifurcated to form a vertically spaced pair of a spring leg for contact with the corresponding one of the IC chip leads and a terminal leg for connection with a circuit on the printed board. The socket body formed in its laterally central portion with a plurality of slots which opens to a bottom surface of the socket body and into which the anchor leg is press-fitted such that the spring leg and the terminal leg project laterally outwardly of the socket body to leave therebetween an open space available for soldering the terminal legs on the printed circuit board.

REFERENCES:
patent: 4110917 (1978-09-01), Le Grelle
patent: 4252390 (1981-02-01), Bowling
patent: 4417777 (1983-11-01), Bamford
patent: 4422128 (1983-12-01), Zurlinden et al.
patent: 4491377 (1985-01-01), Pfaff
patent: 4555153 (1985-11-01), Bricaud et al.
patent: 4682829 (1987-07-01), Kunkle et al.
patent: 4758176 (1988-07-01), Abe et al.
patent: 4824392 (1989-04-01), Billman et al.

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