Socket for integrated circuit chip

Details Socket for integrated circuit chip Socket for integrated circuit chip

1998-05-21

2000-12-26

Nguyen, Kheim

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

H01R 909

Patent

active

061649805

ABSTRACT:
A three point alignment feature facilitates alignment of an integrated circuit chip relative to a socket that is mounted on a printed circuit board 14. The socket includes four walls that define a rectangle in which the integrated circuit chip is mounted. A first contact point 28 extends inward from a first one 22 of the walls. Second and third contact points 30, 32 extend inward from a second one 20 of the walls, which adjoins the first wall. A first force is applied against the integrated circuit chip from a third one 18 of the walls, which is parallel with the first wall. Second and third forces are applied against the integrated circuit chip from a fourth one 16 of the walls, which is parallel with the second wall. Hence, the integrated circuit chip is aligned in a corner defined by the first and second walls, and is oriented by the three contact points. Spring members 34, 36, 38, 40 may be employed to provide the first, second and third forces. Another alignment feature is employed to facilitate alignment of the socket with respect to the printed circuit board. Further, captive hardware fasteners may be employed to attache the socket to the printed circuit board.

REFERENCES:
patent: 5161983 (1992-11-01), Ohno et al.
patent: 5215472 (1993-06-01), DelPrete et al.
patent: 5221209 (1993-06-01), D'Amico
patent: 5362985 (1994-11-01), Ma et al.
patent: 5611654 (1997-03-01), Frattarola et al.
patent: 5702256 (1997-12-01), Severn
patent: 5713744 (1998-02-01), Lamb
patent: 5905416 (1999-05-01), Shimid et al.

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