Socket for inspection of semiconductor device

Details Socket for inspection of semiconductor device Socket for inspection of semiconductor device

1997-12-08

1999-11-02

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439331, 439 91, H01R 909

Patent

active

059759151

ABSTRACT:
A socket for the inspection of semiconductor devices is disclosed which has laterally extended leads. The device is mounted in a mounting seat of the socket body and results in improvement of the inspection process because difficult steps such as soldering can be omitted. The socket is composed of a socket body which is mountable on a circuit board having a mounting seat therefor, a lead frame intervening between the socket body and the circuit board and an anisotropically electroconductive elastic connector sheet.

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Patent Abstracts of Japan, vol. 97, No. 6, Jun. 30, 1997 & JP 09 035789--(Shin-Etsu Polymer Co. Ltd.) Feb. 7, 1997.
Patent Abstracts of Japan, vol. 96, No. 08, Aug. 30, 1996 & JP 08 096911--(Shin-Etsu Polymer KK) Apr. 12, 1996.
Patent Abstracts of Japan, vol. 97, No. 6, Jun. 30, 1997 & JP 09 033606--(Shin-Etsu Polymer Co. Ltd.) Feb. 7, 1997.
Patent Abstracts of Japan, vol. 97, No. 4, Apr. 30, 1997 & JP 08 335486--(Shin-Etsu Polymer Co. Ltd.) Dec. 17, 1996.
Database WPI--Section EI, Week 9805--Derwent Publications Ltd.--Class S01, AN980049020 & JP 09 298 257 A (Shin-Etsu Polymer KK) Nov. 1997.

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