Electrical connectors – With coupling separator – Nonconducting pusher
Reexamination Certificate
2000-06-13
2001-08-21
Ta, Tho D. (Department: 2833)
Electrical connectors
With coupling separator
Nonconducting pusher
C439S330000
Reexamination Certificate
active
06276949
ABSTRACT:
FIELD OF THE INVENTION
This invention generally relates to the art of IC sockets and, particularly, to a retention/ejection system for an IC package mounted within the socket.
BACKGROUND OF THE INVENTION
An IC socket is used for performing burn-in tests of IC packages. In other words, an IC package is tested for a given number of hours at given, sometimes elevated, temperatures to ensure that the IC package will not fail during normal operation. Such an IC socket typically includes a dielectric socket body or housing which mounts a plurality of terminals in respective terminal-receiving passages in the body. In some sockets, first contact ends of the terminals receive respective solder balls of a ball grid array of the IC package, for instance. The opposite ends of the terminals have tails which engage circuit traces on a printed circuit board. Spring portions typically are provided intermediate the opposite contact ends of the terminals for applying contact pressure at the interconnections with the solder balls and the printed circuit board. Burn-in sockets of this type are shown in Japanese Unexamined Patent Publication Nos. Heisei 6-203926 and 9-162332.
During a burn-in test, it is necessary that the IC package be held by some form of retaining means whereby the respective solder balls of the package are maintained in contact with the respective contact terminals of the IC socket with sufficient pressure to overcome any oxide film on the surface of the solder balls in order to obtain reliable connections between the solder balls and contact terminals. Unfortunately, problems arise during the testing under high pressure in that the solder balls may melt quite slightly and become adhered to the contact ends of the terminals. Consequently, it may be difficult to remove the IC package from the socket after testing. The present invention is directed to solving these problems by providing an IC socket of the character described with a new and improved retainer/ejector system for holding the IC package in and ejecting the IC package from the IC socket.
SUMMARY OF THE INVENTION
An object, therefore, of the invention is to provide a new and improved socket for an IC package having a plurality of contacts.
In the exemplary embodiment of the invention, the IC socket includes a socket body mounting a plurality of terminals and having a receptacle in the top of the body for receiving the IC package with the contacts thereof in engagement with the terminals. At least one retainer/ejector member is mounted on the socket body adjacent the receptacle for movement relative to the body from a first position retaining the IC package in the receptacle and a second position at least partially ejecting the IC package from the receptacle. An actuator member is movably mounted on the socket body and is operatively associated with the retainer/ejector member for moving the retainer/ejector member from its first position to its second position.
A support frame also may be movably mounted on the socket body about the receptacle and on which the IC package is supported. The retainer/ejector member includes a retaining portion for engaging the IC package and holding the package in the receptacle. The retainer/ejector member includes an ejecting portion for engaging and moving the support frame and, thereby, at least partially ejecting the IC package.
As disclosed herein, the receptacle is generally rectangular and is generally centrally located in the top of the socket body. A plurality of the retainer/ejector members are spaced about the receptacle, preferably at each of the four sides of the rectangular receptacle.
In the preferred embodiment, each retainer/ejector member is provided in the form of an arm pivotally mounted on the socket body at a side of the receptacle and cantilevered into the receptacle when in its first or retaining position. The arm has a retaining portion near a distal end thereof for engaging the IC package and holding the package in the receptacle. The arm has an ejecting portion near a proximal end thereof adjacent the pivot point of the arm for engaging the support frame for the IC package. The actuator member is provided in the form of an actuator rim mounted to the top of the socket body substantially surrounding the receptacle and operatively associated with all of the plurality of retainer/ejector arms.
Other features of the invention include complementary interengaging cam means between the retainer/ejector arms and the actuator rim for moving the arms in response to movement of the rim. A plurality of springs are spaced about the actuator rim between the rim and the socket body for biasing the rim toward a retaining position and, thereby, bias the retainer/ejector arms toward their first or retaining positions.
Other objects, features and advantages of the invention will be apparent from the following detailed description taken in connection with the accompanying drawings.
REFERENCES:
patent: 4533192 (1985-08-01), Kelley
patent: 4799897 (1989-01-01), Mogi et al.
patent: 4832610 (1989-05-01), Matsuoka
patent: 5002499 (1991-03-01), Matsuoka
patent: 5320550 (1994-06-01), Uratsuji et al.
patent: 5348489 (1994-09-01), Yeh
patent: 5470247 (1995-11-01), Fuchigami
patent: 5531608 (1996-07-01), Abe
patent: 5865639 (1999-02-01), Fuchigami et al.
patent: 2 274 212 (1994-07-01), None
patent: 6-203926 (1994-07-01), None
patent: 9-162332 (1997-06-01), None
Kaneshige Akira
Nakano Tomohiro
Cohen Charles S.
Molex Incorporated
Ta Tho D.
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