Electrical connectors – Coupling part having handle or means to move contact...
Patent
1995-12-20
1997-12-23
Bradley, P. Austin
Electrical connectors
Coupling part having handle or means to move contact...
H01R 1122
Patent
active
057001553
ABSTRACT:
A socket for an IC package includes a socket body having a plurality of contacts arranged thereon so as to be contacted respectively with corresponding leads arranged on the IC packages. Also a contact shutter cover is mounted on an upper surface of the socket body so as to permit upward and downward movement thereof. The contacts are displaced between a contacting position and a contact-releasing position in accordance with the upward and downward movement of the contact shutter cover. The socket for an IC package further includes a positioning device provided on the contact shutter cover and adapted to restrict side surfaces of the leads of the IC package placed in the socket body.
REFERENCES:
patent: 5205756 (1993-04-01), Myers
patent: 5395260 (1995-03-01), Hayakawa et al.
Bradley P. Austin
Kim Yong Ki
Yamaichi Electronics Co. Ltd.
LandOfFree
Socket for IC package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Socket for IC package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Socket for IC package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1798339