Socket for IC package

Electrical connectors – Coupling part having handle or means to move contact...

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Details

H01R 1122

Patent

active

057001553

ABSTRACT:
A socket for an IC package includes a socket body having a plurality of contacts arranged thereon so as to be contacted respectively with corresponding leads arranged on the IC packages. Also a contact shutter cover is mounted on an upper surface of the socket body so as to permit upward and downward movement thereof. The contacts are displaced between a contacting position and a contact-releasing position in accordance with the upward and downward movement of the contact shutter cover. The socket for an IC package further includes a positioning device provided on the contact shutter cover and adapted to restrict side surfaces of the leads of the IC package placed in the socket body.

REFERENCES:
patent: 5205756 (1993-04-01), Myers
patent: 5395260 (1995-03-01), Hayakawa et al.

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