Socket for IC package

Details Socket for IC package Socket for IC package

1993-08-10

1995-02-07

Nguyen, Khiem

Electrical connectors

Coupling part having handle or means to move contact...

439331, H01R 1362

Patent

active

053871189

ABSTRACT:
A socket for an IC package includes a base member having a receptacle space for the IC package, a plurality of contacts arranged in parallel along the sides of the receptacle space of the base member. The contacts each have a contact portion for contact with a corresponding lead of the IC package received in the receptacle space. A spring portion urges the contact portion inwardly to obtain a contact pressure against a lead. A connecting shaft is pivotally supported vertically along each row of the contacts, and is associated with the contacts. A cover covers the base member, and the connecting shaft pivots by depression of the cover to displace the contact portion of each contact outwardly away from the corresponding lead of the IC package against a biasing force of the spring portion. The contact has a curved, first spring portion extending upwardly and inwardly from an inside edge of a plate portion. A second spring portion is bent inwardly from a front end of the first spring portion and is contiguous to the contact portion, and a projection is formed on an upper surface of the second spring portion. The connecting portion has an engaging recess for engagement with the projection and also has an engaging face for engagement with the portion behind the projection. The cover includes inclined surface for allowing the movable cams to move pivotally outwardly.

REFERENCES:
patent: 3710299 (1973-01-01), Weisenburger
patent: 3763462 (1973-10-01), Ecker
patent: 4077688 (1978-03-01), Cobaugh et al.
patent: 4148537 (1979-04-01), Sochor
patent: 4332431 (1982-06-01), Bobb et al.
patent: 4378139 (1983-03-01), Griffin et al.
patent: 4461525 (1984-07-01), Griffin
patent: 4491377 (1985-01-01), Pfaff
patent: 4498047 (1985-02-01), Hexamer et al.
patent: 4533192 (1985-08-01), Kelley
patent: 4623208 (1986-11-01), Kerul et al.
patent: 4630875 (1986-12-01), Korsunsky et al.
patent: 4645279 (1987-02-01), Grabbe et al.
patent: 4691975 (1987-09-01), Fukunaga et al.
patent: 4715823 (1987-12-01), Ezura et al.
patent: 5020998 (1991-06-01), Ikeya et al.
patent: 5186641 (1993-02-01), Uratsuji
patent: 5228866 (1993-07-01), Espenshade et al.
patent: 5244404 (1993-09-01), Kishi et al.
patent: 5249972 (1993-10-01), Walker
Brearley et al., "Latchable Contact Card-To-Board Connector", IBM Technical Disclosure Bulletin, vol. 13, No. 9, Feb. 1971, p. 2590.
English language abstract of Japanese Patent Application No. 4-154065.
English language abstract of Japanese Patent Application No. 63-307678.

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