Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1993-05-26
1994-10-04
Paumen, Gary F.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439525, H01R 2372
Patent
active
053521242
ABSTRACT:
A socket for an IC package includes a plurality of contacts arranged in array in such a manner as to correspond to a plurality of IC leads of an IC package. Each of the contacts comprises a first unitary contact extending to a lower surface portion of each of the unitary IC leads so as to be brought into pressure contact with the lower surface portion, and a second unitary contact extending to a side surface portion of the lead so as to be brought into pressure contact with the side surface portion. The first and second unitary contacts have male terminals separately connected to a wiring board, respectively.
REFERENCES:
patent: Re31929 (1985-06-01), Donaher et al.
patent: 3999827 (1976-12-01), Hutchison et al.
patent: 4252390 (1981-02-01), Bowling
patent: 4614387 (1986-09-01), Hartl
patent: 4746299 (1988-05-01), Matsuoka et al.
Matsuoka Noriyuki
Tsubota Eisaku
Paumen Gary F.
Vu Hien D.
Yamaichi Electronics Co. Ltd.
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