Socket for IC package

Details Socket for IC package Socket for IC package

1994-07-11

1995-07-11

Nguyen, Khiem

Electrical connectors

Coupling part having handle or means to move contact...

439331, H01R 1122

Patent

active

054315794

ABSTRACT:
A receiving tray 6 is disposed on a pedestal surface 1a of a base member 1 vertically and movably, while below the pedestal surface 1a are disposed a push-up member 7 interlocked with the receiving tray and a spring 8 for urging the push-up member 7 downwards. A seating surface if for package leads P2 is formed along side portions of the pedestal surface 1a, and a large number of contacts 2 are arranged side by side, the contacts 2 having respective contact portions 2a for contact with the leads P2 which contact portions 2a are urged inwards to obtain a predetermined contact pressure for the leads. There are used movable cams 4 adapted to rotate upon depression of a cover 5 which covers the base member, to displace the contact portions 2a of the contacts 2 outwards away from the package leads P2. The movable cams 4 are each provided with an actuating arm 4c which comes into abutment with the push-up member 7 upon depression of the cover 5 and consequent rotation of the cam 4 to push up the receiving tray 6.

REFERENCES:
patent: 4498047 (1985-02-01), Hexamer et al.
patent: 4533192 (1985-08-01), Kelley
patent: 4715823 (1987-12-01), Ezura et al.
patent: 5244404 (1993-09-01), Kishi et al.
patent: 5326271 (1994-07-01), Kishi et al.
English Language Abstract of JP 4-154065.
English Language Abstract of JP 63-307678.

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