Socket for IC device

Details Socket for IC device Socket for IC device

2000-06-06

2001-11-27

Paumen, Gary (Department: 2833)

Electrical connectors

With coupling movement-actuating means or retaining means in...

For dual inline package

Reexamination Certificate

active

06322383

ABSTRACT:

TECHNICAL FIELD
The present invention relates to a socket for an IC device and, more particularly, to a socket used to connect the contact portions of numerous terminals of an IC device with contact portions printed on a printed circuit board. Especially, the invention relates to a socket for a leadless IC device.
BACKGROUND OF THE INVENTION
In recent years, IC devices have made transition to the leadless surface-mount type. For this purpose, IC devices assume a form adapted for the surface-mount type. That is, numerous terminal contact portions are formed without unevenness on the rear surfaces of IC devices. However, it is difficult to make electrical connections by directly making the rear surface of an IC device of this kind closely adhered to a printed circuit on a printed circuit board. Hence, a socket is necessary between the contact portions of the IC device and the contact portions of the printed circuit.
To this end, in the socket structure used for an IC device of this kind, pressure is applied between the contact portions of numerous terminals formed on the rear surface of the IC device and the printed contact portions on the printed circuit board. Since the connection is completed by the applied pressure force and by the resulting repulsive force, the pressure must be constantly applied, Therefore, the actual situation is that stable electrical connection cannot be achieved because it is impossible to apply uniform pressure to many terminals.
Accordingly, it is an object of the present invention to provide a socket which is used for an IC device and which makes electrical connections between the contact-portions of numerous terminals of a leadless IC device and the printed contact portions on a printed circuit board easily and reliably, the socket having a cover that is pushed downward to permit locking levers disposed in four directions to hold the IC device therebetween reliably in one-touch operation.
DISCLOSURE OF THE INVENTION
The present inventors have conducted investigations earnestly in view of the foregoing problem and made a structure comprising: a cover having openings in its top and bottom surfaces, respectively; a base frame having openings in its top and bottom surfaces withdrawably inserted via a coil spring in the bottom surface of the cover; a base frame-fixing frame for limiting sinking movement of the base frame; boards vertically stacked with the base frame; through-holes for contact elements penetrating the boards and the base frame; contact elements inserted in the through-holes for contact elements; fixing pins used for a printed circuit board and protruding from the bottom surface of the base frame; and locking means mounted between the cover and the base frame. The locking means have locking lever-fixing shafts extending horizontally and mounted at the four sides of the cover and the base frame. Locking levers are pivotally mounted to the locking lever-fixing shafts, respectively. Kick springs are wound around the locking lever-fixing shafts, respectively. The kick springs engage the cover and the locking levers. Each locking lever has a locking lever-pushing portion and IC device-sandwiching portions. The cover is pushed downward to cause inner corner portions to push against the locking lever-pushing portions. Each contact element comprises contact element center-winding portion fabricated by closely winding a wire into a coil and contact element both side-winding portions extending from the contact element center-winding portion. Each contact element both side-winding portion has portions closely adhered to both sides of the contact element center-winding portion and a spacing winding portion. The contact elements have both-end portions protruding and inserted into the contact element through-holes, respectively.
The action of the present invention is as follows. The contact elements each fabricated by winding a spring wire into a coil are used. The contact elements electrically connect the contact portions of numerous terminals of a leadless IC device with the printed contact portions on a printed circuit board. This assures reliable and stable connections. Further, by depressing the cover of the socket, the locking levers disposed in four directions are rotated and the IC device-sandwiching portions are released. Thus, the IC device is held between them by releasing the pressure and electrical connections are made easily.


REFERENCES:
patent: 4715823 (1987-12-01), Ezura et al.
patent: 5562473 (1996-10-01), Ikeya et al.
patent: 5902144 (1999-05-01), Hay
patent: 6033235 (2000-03-01), Ikeya
patent: 0457443 A2 (1991-11-01), None
patent: H5-47445 (1993-02-01), None
patent: H9-121007 (1997-05-01), None
patent: 10-255940 (1998-09-01), None

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