Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
1999-09-28
2001-01-16
Paumen, Gary F. (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S066000, C439S091000, C439S931000
Reexamination Certificate
active
06174174
ABSTRACT:
TECHNICAL FIELD
This invention relates to a socket used for inspecting a so-called inner surface mounting type IC having a bump arranged and formed on a bottom surface of the main body portion of the IC, and a manufacturing method for manufacturing the IC using this socket.
BACKGROUND ART
Up to now, a socket configured as shown in
FIG. 1
is used as a socket for pre-shipment inspection of the inner surface mounting type IC. This socket includes a pre-set number of contact terminals
3
arranged in a main body portion
2
. Referring to
FIG. 1
, the portion of the contact terminal
3
lying within the main body portion
2
of the socket is bowed to follow a stepped portion in the main body portion
2
of the socket, with a distal end of the contact terminal
3
operating as a contact portion
3
a
and a portion of the contact terminal
3
protruded from the bottom surface of the main body portion
2
of the socket operating as a terminal
3
b
. A retainer member
5
is rotationally mounted via a hinge
4
on the main body portion
2
of the socket.
An IC
6
to be housed in the socket
1
is housed in its main body portion
2
with a bump
7
as an external electrode on the bottom surface of a main body portion
8
of the IC in position for contacting with a contact portion
3
a
of a contact terminal
3
arranged in the main body portion
2
of the socket. The IC
6
is thrust and supported in position by a thrusting portion
5
a
provided as a boss on a surface of the retainer member
5
which is rotated for closing an upper opening side of the main body portion
2
of the socket. When rotated for closing the opening side of the main body portion
2
of the socket to thrust and support the IC
6
housed in the main body portion
2
of the socket, as shown in
FIG. 1
, the retainer member
5
is locked by a lock member, not shown, provided in the main body portion
2
of the socket, whereby the IC
6
is kept in the thrust and supported state.
The above-described socket
1
can be used for such a case wherein the bump arraying pitch is broader and wherein two rows of bumps are each arranged on opposite sides of the bottom of the main body portion
8
of the IC, as shown in FIG.
1
. However, the above-described configuration cannot be applied to a ball grid array (BGA) type IC or to a chip size package (CSP) type IC in which a large number of bumps are arranged in a matrix configuration on the bottom of the main body portion of the IC. That is, in the socket
1
shown in
FIG. 1
, contact portions
3
a
of contact terminals
3
constituted by metal pins are bowed for extending along the bottom surface of the main body portion
2
of the socket, plural bumps formed on the BGA type or CSP type IC are simultaneously contacted with the sole contact portions
3
a
to render it impossible to cause the bumps and the contact portions
3
a
to be contacted with each other independently.
DISCLOSURE OF THE INVENTION
It is an object of the present invention to provide a socket for an IC which renders it possible to house an IC on the main body portion of which a large number of bumps as external electrodes are mounted in a matrix configuration.
It is another object of the present invention to provide a socket for an IC in which an IC can be housed therein in a condition in which a large number of bumps of the IC arranged at a narrow pitch in a matrix configuration are connected with high electric and mechanical reliability to the electrodes provided on the socket.
It is still another object of the present invention to provide an socket for an IC which is high in durability and reliability.
It is still another object of the present invention to provide an socket for an IC having optimum electrical properties such as low resistance value and low inductance value of a connection conductor electrically connected to the external electrodes provided on the IC.
It is still another object of the present invention to provide an socket for an IC wherein the value of the connection resistance across the external electrodes provided on the IC and the contact electrodes provided on the socket can be reduced further.
It is a further object of the present invention to provide a socket for an IC wherein crosstalk between contacts provided on the socket can be reduced to prevent deterioration of transmitted signals.
It is a further object of the present invention to provide a manufacturing method for an IC whereby an IC of high reliability can be produced by reliable electrical and mechanical connection between the external electrodes provided on the IC and the terminals provided on the socket adapted for housing the IC.
It is a further object of the present invention to provide a manufacturing method for an IC whereby the value of the connection resistance across the external electrodes provided on the IC and the contact electrodes provided on the socket can be reduced further.
It is yet another object of the present invention to provide a manufacturing method for an IC whereby the crosstalk between contacts provided on the socket can be reduced to prevent deterioration of transmitted signals.
In one aspect, the present invention provides a socket for an IC including a printed circuit board on one surface of which a plurality of contact electrodes are arranged at the same pitch as an arraying pitch of external electrodes for the IC and on the opposite surface of which are arranged a plurality of terminal electrodes connected to the contact electrodes, an anisotropic electrically conductive adhesive arranged on the contact electrodes of the printed circuit board, a base block arranged on the one surface of the printed circuit board and having an opening for setting the IC therein, the opening facing the anisotropic electrically conductive adhesive, and a plurality of coil-shaped contacts arranged in the opening, one ends of which are positioned above the contact electrodes via the anisotropic electrically conductive adhesive and the other ends of which are protruded from the opening. The contact electrodes and the coil-shaped contacts facing each other via the anisotropic electrically conductive adhesive are mechanically and electrically connected to each other via the anisotropic electrically conductive adhesive.
In another aspect, the present invention provides a socket for an IC including a printed circuit board on one surface of which a plurality of contact electrodes are arranged at the same pitch as an arraying pitch of external electrodes for the IC and on the opposite surface of which are arranged a plurality of terminal electrodes respectively connected to the contact electrodes, a base block for setting the IC therein, the base block being arranged on the one surface of the printed circuit board and having a plurality of through-holes facing sais contact electrodes, an electrically conductive film formed on an inner peripheral surface of each of the through-holes, and a plurality of coil-shaped contacts arranged in the plural through-holes, one ends of the coil-shaped contacts being contacted with the contact electrodes and the opposite ends thereof being protruded from the through-holes. The coil-shaped contacts are thrust at the opposite ends thereof by the external electrodes of the IC so that the coil-shaped contacts are contacted with the electrically conductive films provided in the through-holes. The electrically conductive films operate in conjunction with the coil-shaped contacts as a connecting conductor between the external electrodes of the IC and the contact electrodes.
In still another aspect, the present invention provides a socket for an IC including a printed circuit board on one surface of which a plurality of contact electrodes are arranged at the same pitch as an arraying pitch of external electrodes for the IC and on the opposite surface of which are arranged a plurality of terminal electrodes respectively connected to the contact electrodes, a base block for setting the IC therein, the base block being arranged on the one surface of the printed circuit board and having a
Hiroike Toshimasa
Ikeda Shigeo
Izawa Hisataka
Maru Yasuo
Nagano Hiroshi
Kananen Ronald P.
Paumen Gary F.
Rader Fishman & Grauer
Sony Corporation
Ta Tho D.
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