Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2006-07-18
2006-07-18
Prasad, Chandrika (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S482000
Reexamination Certificate
active
07077661
ABSTRACT:
A socket for a microelectronic component is provided. The socket contains power, ground and signal conductors. It further contains a plurality of electrical conductors, each with a respective stop component, interconnection element, spring portion and protrusions. A plurality of protrusions is equal amongst each respective electrical conductor and identical in height. A plurality of electrical conductors are inserted into a respective opening within the socket body, a select plurality of electrical conductors electrically connects, via protrusions that frictionally fit, to either a power, ground or signal plane for the purpose of providing current to the integrated circuit. While a first plurality of electrical conductors are electrically connected through the same power, ground or signal conductor, they are also electrically disconnected from a second plurality of electrical conductors that are electrically connected though another conductors, not the same as the first.
REFERENCES:
patent: 3959868 (1976-06-01), Mathe
patent: 4220393 (1980-09-01), Ammon et al.
patent: 4494172 (1985-01-01), Leary et al.
patent: 4868980 (1989-09-01), Miller, Jr.
patent: 5102352 (1992-04-01), Arisaka
patent: 5538433 (1996-07-01), Arisaka
patent: 6016254 (2000-01-01), Pfaff
patent: 6210176 (2001-04-01), Hsiao
patent: 6471538 (2002-10-01), Zhou et al.
patent: 6736665 (2004-05-01), Zhou et al.
patent: 6805561 (2004-10-01), Walkup et al.
patent: 2001/0004556 (2001-06-01), Zhou et al.
patent: 2004/0077190 (2004-04-01), Huang et al.
patent: 2004/0192081 (2004-09-01), Koopman et al.
patent: 2004/0203264 (2004-10-01), Liao et al.
PCT Search Report, PCT/US2005/001563, Jun. 14, 2005 Intel Corporation, 7 pages.
Frutschy Kris
Renfro Tim
Blakely , Sokoloff, Taylor & Zafman LLP
Intel Corporation
Prasad Chandrika
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