Socket for electrical parts

Details Socket for electrical parts Socket for electrical parts

2000-11-29

2004-11-30

Vu, Hien (Department: 2833)

Electrical connectors

Coupling part having handle or means to move contact...

C439S330000

Reexamination Certificate

active

06824411

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a socket for an electrical part for detachably holding an electrical part such as semiconductor (called “IC package” herein) having, particularly, an improved structure of a guide structure for guiding the electrical part at a time of accommodation thereof into a socket.
2. Prior Art of the Invention
In the known art, there has been provided an IC socket as a “socket for an electrical part” for detachably holding an IC package as an “electrical part”.
FIGS. 10A and 10B
, for example, show a portion of such IC socket
1
, which comprises a socket body
2
of so-called a two-body structure having a base
3
and a slide plate
4
disposed on the upper side of the base
3
to be slidable thereon. A number of contact pins
5
are disposed to the base
3
of the socket body
2
.
Each of the contact pin
5
are formed, at its upper portion, with an elastically deformable movable contact portion
5
a
and a stationary contact portion
5
b
. When the slide plate
4
is slid, in the left side direction in the figures, the movable contact portion
5
a
is elastically deformed to thereby widen the distance between both the contact portions
5
a
and
5
b
as shown in
FIG. 10A and
, on the other hand, when the slide plate
4
is slid in the right side direction, the distance between these contact portions
5
a
and
5
b
is made narrow as shown in FIG.
10
B.
Furthermore, the slide plate
4
has a structure capable of accommodating an IC package
6
, and guide portions
4
a
for guiding the IC package
6
to a predetermined position are disposed to both end edge portions of the slide plate
4
so as to project upward.
According to such structure, when the IC package
6
is mounted to the predetermined position, the slide plate
4
is slid in the left side direction as shown in
FIG. 10A
so as to open the distance between both the contact portions
5
a
and
5
b
of the contact pin
5
. Under the state, the IC package
6
is guided by the guide portions
4
a
at both end edge portions of the slide plate
4
to thereby mount the IC package
6
to the predetermined position on the slide plate
4
. During this operation, a terminal
6
a
having a pin-shape of the IC package
6
is inserted between both the contact portions
5
a
and
5
b
. A number of such terminals are disposed so as to correspond to the contact pins
5
, respectively.
Thereafter, when the slide plate
4
is moved in the right side direction as viewed in
FIG. 10B
, the movable contact portion
5
a
is returned by an elastic force thereof so as to clamp the terminal
6
a
between both the contact portions
5
a
and
5
b
and hence establish an electrical connection therebetween.
FIGS. 11 and 12
show other conventional examples of the IC socket
1
, in which a top plate
8
, as a stationary portion, is disposed on the base
3
through the slide plate
4
.
When the slide plate
4
is slid in the left side direction as viewed in
FIG. 11
, the movable contact portion
5
a
of the contact pin
5
is elastically deformed so as to open the distance between both the contact portions
5
a
and
5
b
. Under the state, an IC package
9
is guided by guide portions
8
a
disposed at both end edge portions of the top plate
8
to thereby mount the IC package
9
to the predetermined position on the top plate
8
. During this operation, a solder ball
9
a
as a terminal of the IC package
9
is inserted between both the contact portions
5
a
and
5
b.
Thereafter, when the slide plate
4
is moved in the right side direction, the movable contact portion
5
a
is returned by an elastic force thereof so as to push the solder ball
9
a
of the IC package
9
to thereby slide the IC package
9
in the right direction (FIG.
12
), and hence to clamp the solder ball
9
a
between both the contact portions
5
a
and
5
b
, thus establishing an electrical connection therebetween.
However, with the conventional structure shown in
FIGS. 10A and 10B
, the guide portions
4
a
for guiding both the end edge portions of the IC package
6
is formed to both end portions in the moving direction of the slide plate
4
. Then, according to this structure, when the distance L
1
between these guide portions
4
a
is set to be slightly wider than the width L
2
of the IC package
6
, there is a fear of giving an adverse affect on the contacting state between the contact portions
5
a
and
5
b
and the pin-shaped terminal
6
a
. That is, by setting the distance L
1
between these guide portions
4
a
to be slightly wider than the width L
2
of the IC package
6
, the IC package
6
can be mounted to the predetermined position of the slide plate
4
. However, under such setting, when the slide plate
4
is moved from the state shown in
FIG. 10A
to the state shown in
FIG. 10B
, the pin-shaped terminal
6
a
of the IC package
6
abuts against the stationary contact portion
5
b
of the contact pin
5
, and thereby, rightward movement of the IC package
6
is limited and the guide portions
4
a
of the slide plate
4
interfere with the left side end edge portion
6
b
of the IC package
6
. Thus, the movement of the slide plate
4
is limited, the returning amount of the movable contact portion
5
a
is made small, and hence, the movable contact portion
5
a
is not sufficiently contacted to the pin-shaped terminal
6
a
, thus providing a problem (see FIG.
10
B).
Further, with the conventional structure of FIGS.
11
and
12
, the guide portions
8
a
for guiding both the end edge portions of the IC package
9
are formed to both the end portions of the top plate
8
. Then, according to such structure, when the distance L
1
between both the guide portions
8
a
is set to be slightly wider than a width L
2
of the IC package
9
, there is a fear of giving an adverse affect on the contacting state between the contact portions
5
a
and
5
b
and the solder ball
9
a
of the IC package
9
. That is, by moving the slide plate
4
rightward, the solder ball
9
a
of the IC package
9
is pressed during the returning motion of the movable contact portion
5
a
to thereby slide the IC package in the right direction as viewed in figures. Therefore, the right end edge portion
9
b
of the IC package
9
interferes with the guide portions
8
a
, thus limiting the movement thereof and, hence, there is a fear of providing an insufficient contact state between the stationary contact portion
5
b
and the solder ball
9
a.
SUMMARY OF THE INVENTION
An object of the present invention is to substantially eliminate defects or drawbacks encountered in the prior art mentioned above and to provide a socket for electrical parts capable of ensuring a good guiding performance of the electrical part at the accommodation time thereof as well as achieving a good contact condition of a contact pin to a terminal of the electrical part.
This and other objects can be achieved according to the present invention by providing, in one aspect, a socket for an electrical part which comprises a socket body having a stationary portion to which a number of contact pins are disposed so as to be contacted to or separated from a number of terminals, respectively, disposed to an electrical part, each of the contact pins having first and second contact portions between which each of the terminals is clamped, the socket body being provided with a slide plate to be transversely slidable in a usable state of the socket, and in which one of said first and second contact portions is displaced by sliding the slide plate to thereby open or close the first and second contact portions,
wherein the stationary portion is formed with a first guide portion for guiding a front side end edge portion, of the electrical part, in a sliding direction of the slide plate at a time of opening the contact portions of the contact pin and the slide plate is formed with a second guide portion for guiding the front side end edge portion, of the electrical part, in the sliding direction of the slide plate at a time of closing the conta

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