Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1993-07-15
1994-08-30
Paumen, Gary F.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439331, 439381, H01R 2368
Patent
active
053422066
ABSTRACT:
The present invention is a socket for removably connecting electrical conductors directly to the bond pads of an integrated circuit chip, and includes a chip holder that locks into the socket for burn-in and other testing and then can be removed and easily handled by automated equipment in the further processing of the chip. The socket has a series of contacts that are guided into electrical engagement with the bond pads through precisely positioned openings in a ceramic plate. The ceramic plate and the chip holder are aligned by a pair of guide pins that project from a housing. A pair of latching members secure the chip holder to the housing during burn-in and testing.
REFERENCES:
patent: 4018494 (1977-04-01), Scheingold et al.
patent: 4609243 (1986-09-01), Wyss
patent: 4713022 (1987-12-01), Pfaff
patent: 5057904 (1991-10-01), Nagato et al.
patent: 5068601 (1991-11-01), Parmenter
patent: 5106309 (1992-04-01), Matsuoka et al.
patent: 5117330 (1992-05-01), Miazga
patent: 5247250 (1993-09-01), Rios
Grabbe Dimitry G.
Korsunsky Iosif
Nina Driscol A.
Paumen Gary F.
The Whitaker Corporation
Wolstoncroft Bruce J.
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