Socket for chip package test

Details Socket for chip package test Socket for chip package test

1997-07-15

2000-05-16

Bradley, Paula

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439 66, H01R 909

Patent

active

060628731

ABSTRACT:
A socket for a semiconductor device having solder balls includes a circuit substrate, an interposing sheet and a holder. The circuit substrate has conductive bumps on one side thereof corresponding to the solder balls, respectively. The interposing sheet has interposing electrodes through the interposing sheet corresponding to the solder balls, respectively. The diameter of each interposing electrode is greater than that of each solder ball. The holder holds the semiconductor device on the circuit substrate through the interposing sheet under a load such that the interposing electrodes electrically connects the solder balls to the conductive bumps, respectively.

REFERENCES:
patent: 5691041 (1997-11-01), Frankeny et al.
patent: 5702255 (1997-12-01), Murphy et al.
patent: 5794330 (1998-08-01), Distefano et al.
patent: 5813870 (1998-09-01), Gaynes et al.

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