Socket for BGA packages

Details Socket for BGA packages Socket for BGA packages

2000-02-08

2001-09-25

Patel, Tulsidas (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

Reexamination Certificate

active

06293810

ABSTRACT:

CROSS REFERENCE TO RELATED APPLICATIONS
N/A
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT
BACKGROUND OF THE INVENTION
One well known form of electronic package is the ball grid array (BGA) package in which an electronic circuit, typically an integrated circuit, is contained within a thin rectangular housing having an array of ball shaped electrical contacts on a surface of the package. Such a package is typically mounted to a corresponding array of contact areas of a printed circuit board. Since the BGA package is soldered directly to a circuit board, the package is not removable from the board without unsoldering. Sockets are known for removably mounting electronic circuit packages onto printed circuit boards; however, sockets for BGA packages have not heretofore been successfully implemented. Test sockets are known for testing BGA packages but such test sockets are generally complex and relatively large and cumbersome and are impractical for use in usual circuit board environments.
BRIEF SUMMARY OF THE INVENTION
In accordance with the present invention, a socket for a BGA package is provided which is of relatively simple construction and which provides reliable and efficient interconnection of a BGA package and a printed circuit board. The socket comprises a contact assembly having an array of resilient conductive columns having respective contact ends, the columns being mounted on a thin insulative sheet. The contact assembly is supported on a frame of insulating material and which has alignment posts for alignment of the contact assembly to the frame and for alignment of the frame and mounted contact assembly to an associated circuit board. The frame also includes latch elements for retaining the contact assembly on the frame.
For use, the socket is mounted onto a printed circuit board which has an array of contact areas corresponding to the array of resilient contacts of the socket. A BGA package is placed onto the socket frame and the package is maintained in alignment on the frame such that the ball contacts engage the respective contacts of the contact assembly of the socket. The package is retained in the socket by a retention mechanism. The socket can include elements for preventing overstress of the resilient contacts.


REFERENCES:
patent: 4239312 (1980-12-01), Myer et al.
patent: 5152694 (1992-10-01), Bargain
patent: 5155905 (1992-10-01), Miller, Jr.
patent: 5302853 (1994-04-01), Volz et al.
patent: 5730620 (1998-03-01), Chan et al.
patent: 5738531 (1998-04-01), Beaman et al.
patent: 5919050 (1999-07-01), Keheley et al.
patent: 6114757 (2000-09-01), DelPrete

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