Socket device for fine pitch lead and leadless integrated circui

Details Socket device for fine pitch lead and leadless integrated circui Socket device for fine pitch lead and leadless integrated circui

1987-05-15

1988-12-06

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439266, 439330, H01R 2372

Patent

active

047893451

ABSTRACT:
A socket device for an integrated circuit package having fine pitch or closely spaced leads or contact pads. The socket device includes a base having a platform for supporting the IC package. Opposed actuating latches are pivotally carried upon the base at opposite sides of the platform to accommodate receipt and retention of the integrated package. The socket device includes a plurality staggered contacts in multiple ranks at opposite sides of the platform adjacent the actuator latches. The contacts engage the actuator latches so as to be moved between open and closed positions upon pivotal movement of the latches.

REFERENCES:
patent: 4623208 (1986-11-01), Kerul et al.

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