Socket connection test modules and methods of using the same

Details Socket connection test modules and methods of using the same Socket connection test modules and methods of using the same

2005-10-18

2005-10-18

Hollington, Jermele (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S658000

Reexamination Certificate

active

06956387

ABSTRACT:
Test modules, systems, and methods employing capacitors for the testing of the solder joint connections between a printed circuit board (PCB) and a socket of a device are presented in embodiments of the current invention. A test module having capacitors in parallel, and in particular embedded capacitors, can be used to test tied traces and their solder joint connections by measuring the total capacitance of the capacitors. Embodiments of the current invention present no-power tests that can be used with a variety of testing platforms and test fixtures, such as in-circuit testing (ICT) and manufacturing defect analysis (MDA.) Additionally, the test module can be used with a variety of sockets, such as a ball grid array, a pinned grid array, and a land grid array.

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Agilent TestJet Technology White Paper, Agilent Technologies, http://we.home.agilent.com/cgi-bin/bvpub/agilent/editorial/cp_MiscEditorial.jsp?NAV_I..., Dec. 14, 2004, 1 page.
Chapter 3: Agilent TestJet, Optional Board Test Applications, © Agilent Technologies 2001, pp. 3-2 through 3-9 and 3-71 through 3-73.

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