Electrical connectors – With provision to dissipate – remove – or block the flow of heat – Distinct heat sink
Reexamination Certificate
2011-05-24
2011-05-24
Gushi, Ross N (Department: 2833)
Electrical connectors
With provision to dissipate, remove, or block the flow of heat
Distinct heat sink
C439S331000
Reexamination Certificate
active
07946881
ABSTRACT:
A socket assembly has a socket and a heat sink module detachably mounted on the socket. The socket has a base, a sliding board mounted on the base, a lid disposed upon the base and an actuator disposed between the base and the cover. The heat sink module has a fastening frame surrounding the base, a cover pivotally assembled to an end of the fastening frame and a heat sink mounted on the cover. The cover has a latching portion which latches with a top wall of the lid when the cover rotates to a closed position. The heat sink is brought by the cover to pass an open defined on the lid and to abut against an IC package seating on the sliding board.
REFERENCES:
patent: 5186642 (1993-02-01), Matsuoka et al.
patent: 5690281 (1997-11-01), Ikeya et al.
patent: 6280222 (2001-08-01), Walkup
patent: 6354859 (2002-03-01), Barabi et al.
patent: 6547580 (2003-04-01), Leavitt et al.
patent: 6570763 (2003-05-01), McHugh et al.
patent: 6902424 (2005-06-01), Takayama et al.
patent: 7230830 (2007-06-01), Ujike et al.
patent: 7540745 (2009-06-01), Lin
patent: 7559784 (2009-07-01), Hsiao et al.
patent: 7566237 (2009-07-01), Gattuso et al.
patent: 7588450 (2009-09-01), Hsiao et al.
patent: 7632128 (2009-12-01), Lin et al.
patent: 7666021 (2010-02-01), Ma
patent: 7785124 (2010-08-01), Lin et al.
patent: 7803006 (2010-09-01), Lin
patent: 7824188 (2010-11-01), Yokoyama
patent: 7828576 (2010-11-01), Lin et al.
patent: 7833021 (2010-11-01), Lin
patent: 2007/0238327 (2007-10-01), Hsu
patent: 2008/0014780 (2008-01-01), Lin
patent: 2008/0057765 (2008-03-01), Hsiao et al.
patent: 2008/0280477 (2008-11-01), Hsiao et al.
patent: 2009/0104807 (2009-04-01), Lin et al.
patent: 2009/0291582 (2009-11-01), Lin
patent: 2010/0009558 (2010-01-01), Lin et al.
patent: 2010/0144190 (2010-06-01), Yokoyama
patent: 2010/0261371 (2010-10-01), Morinari
patent: 2010/0289513 (2010-11-01), Hsieh et al.
patent: 2010/0291793 (2010-11-01), Hsieh et al.
patent: 2010/0297861 (2010-11-01), Hsieh et al.
Hsiao Shih-Wei
Hsieh Wen-Yi
Nakao Kenzo
Chang Ming Chieh
Cheng Andrew C.
Chung Wei Te
Gushi Ross N
Hon Hai - Precision Ind. Co., Ltd.
LandOfFree
Socket assembly with heat sink module does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Socket assembly with heat sink module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Socket assembly with heat sink module will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2702765