Socket assembly for electrical component

Details Socket assembly for electrical component Socket assembly for electrical component

1995-06-06

1998-06-02

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 439485, 439487, 361707, 361785, H65K 720

Patent

active

057610363

ABSTRACT:
A socket assembly for mechanically and electrically coupling an integrated component with an interfacing carrier comprises a socket body for receiving the integrated component, a retaining spring hingedly connected to the socket body for retaining the integrated component within the socket body, and at least one post element. The socket body includes at least one generally cylindrical receiving member having at least a portion protruding through an aperture in the interfacing carrier which is deformable to engage the socket body with the carrier when the post element is received within the receiving element. The socket body also includes a first mounting surface having plurality of holes for receiving wadded button contacts and a heat transfer element in contacting relation with the mounting side of the integrated component.

REFERENCES:
patent: 2153177 (1939-04-01), Ecker
patent: 2853656 (1958-09-01), Dowds
patent: 3077511 (1963-02-01), Bohrer et al.
patent: 3195628 (1965-07-01), McAdam
patent: 3200297 (1965-08-01), Gibson
patent: 3419844 (1968-12-01), Schmued
patent: 3509206 (1970-04-01), Harshman et al.
patent: 3513434 (1970-05-01), Zielke
patent: 3616532 (1971-11-01), Beck
patent: 3680037 (1972-07-01), Nellis et al.
patent: 3764959 (1973-10-01), Toma et al.
patent: 3795037 (1974-03-01), Luttmer
patent: 3795047 (1974-03-01), Abolafia et al.
patent: 3858958 (1975-01-01), Davies
patent: 3862790 (1975-01-01), Davies et al.
patent: 3873173 (1975-03-01), Anhalt
patent: 3881799 (1975-05-01), Elliott et al.
patent: 3904934 (1975-09-01), Martin
patent: 3917375 (1975-11-01), Johnson
patent: 3971610 (1976-07-01), Buchoff et al.
patent: 4029375 (1977-06-01), Gabrielian
patent: 4082399 (1978-04-01), Barkhuff
patent: 4082407 (1978-04-01), Smorzaniuk et al.
patent: 4092697 (1978-05-01), Spaight
patent: 4168877 (1979-09-01), Little et al.
patent: 4190098 (1980-02-01), Hanlon
patent: 4193108 (1980-03-01), Romano
patent: 4202593 (1980-05-01), Abernethy et al.
patent: 4236776 (1980-12-01), Wellington
patent: 4257661 (1981-03-01), Dalamangas et al.
patent: 4278311 (1981-07-01), Scheingold et al.
patent: 4360858 (1982-11-01), Fahling
patent: 4373778 (1983-02-01), Adham
patent: 4508405 (1985-04-01), Damon
patent: 4539621 (1985-09-01), Currier
patent: 4574331 (1986-03-01), Smolley
patent: 4581679 (1986-04-01), Smolley
patent: 4593961 (1986-06-01), Cosmo
patent: 4595794 (1986-06-01), Wasserman
patent: 4620761 (1986-11-01), Smith et al.
patent: 4679118 (1987-07-01), Johnson et al.
patent: 4682269 (1987-07-01), Pitasi
patent: 4706161 (1987-11-01), Buckingham
patent: 4707657 (1987-11-01), Boegh-Petersen
patent: 4716494 (1987-12-01), Bright et al.
patent: 4731698 (1988-03-01), Millot et al.
patent: 4733172 (1988-03-01), Smolley
patent: 4744009 (1988-05-01), Grabbe et al.
patent: 4750092 (1988-06-01), Werther
patent: 4803546 (1989-02-01), Sugimoto et al.
patent: 4988306 (1991-01-01), Hopfer et al.
patent: 4992053 (1991-02-01), Lindeman et al.
patent: 5000689 (1991-03-01), Ishizuka et al.
patent: 5007841 (1991-04-01), Smolley
patent: 5013249 (1991-05-01), Lindeman
patent: 5074798 (1991-12-01), Carter
patent: 5109980 (1992-05-01), Matsuoka et al.
patent: 5127837 (1992-07-01), Shah et al.
patent: 5163837 (1992-11-01), Rowlette
patent: 5282111 (1994-01-01), Hopfer
ETI, Elastomeric Connector Catalog, copyright 1989, see p. 41.
Franck et al. "Microcircuit Module and Connector", IBM Tech. Disclosure Bulletin, vol. 13, No. 7, Dec. 1970 pp. 1786-1787.
IBM Technical Disclosure Bulletin, p. 58, vol. 13, No. 1, Jun. 1970, "Integrated Circuit Package and Heat Sink.".
Cho-Therm Thermal Interface Materials products catalog, pp. 1-3, 8-14, available to applicant in approximately May 1991.
SMART II Proceedings, Surface Mounting and Reflow Technology Conference, Jan. 1986, pp. 23-37.
EG&G Wakefield Engineering, heat dissipation components product catalog, pp. 1, 24-34, 94-97, 100-102, copyright 1988.
IBM Technical Disclosure Bulletin, vol. 22, No. 1, Jun. 1979, pp. 158-159.
Design News, Designer's Corner, Chip Socket by Rogers Corp., Tempe, AZ. ISO-CON connector, Apr. 8, 1991, p. 50 and undated article on same design.

Affiliated with

Also associated with

Rating

Socket assembly for electrical component does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Socket assembly for electrical component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Socket assembly for electrical component will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1467843