Socket apparatus for testing package

Details Socket apparatus for testing package Socket apparatus for testing package

1998-05-01

1999-11-23

Nguyen, Khiem

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439331, H01R 909

Patent

active

059890398

ABSTRACT:
A socket apparatus for testing a semiconductor package includes a main body having a plurality of contact pins therein, a locking member disposed in the main body for securing the semiconductor package that is to be loaded into the main body, an unlocking member for releasing the package secured by the locking member, and a cover disposed above the locking member and the unlocking member. The socket apparatus improves a contactability between the external terminals of the package and the contact pins during the package testing and decreases production cost due to its simplified composition.

REFERENCES:
patent: 5161984 (1992-11-01), Taylor et al.
patent: 5290193 (1994-03-01), Goff et al.
patent: 5460538 (1995-10-01), Ikeya
patent: 5545050 (1996-08-01), Sato et al.
patent: 5626481 (1997-05-01), Abe
patent: 5646447 (1997-07-01), Ramsey et al.
patent: 5807104 (1998-09-01), Ikeya et al.
patent: 5823794 (1998-10-01), Abe

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