Socket apparatus

Electrical connectors – Coupling part having handle or means to move contact... – Expandable – prong receiving socket

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H01R 1122

Patent

active

056902816

ABSTRACT:
A socket having a structure which is suitable for electrical connection with ball-shaped lead terminals of an IC package is shown. When a cover (12) is pushed down, a latch (70) moves away, a slide plate (40) slides toward the positive side in an X direction through levers (52) and (50) and movable shaft (58) and both arms of each contact maker (30) open. Each lead terminal (solder ball) (32a) of the BGA package (32) is freely inserted between both arms of a respective contact maker (30) when in the open state. When cover (12) rises to its highest position, slide plate (40) slides in the reverse direction by the spring force of a compression coil spring, thereby returning to the its original position and both arms of each contact (32) engage each lead terminal (32a) in such a way as to hold it from opposite sides with a result that an electrical connection based on compressive engagement is obtained between each contact element (30) and each respective terminal (32a).

REFERENCES:
patent: 3763459 (1973-10-01), Millis
patent: 4147213 (1979-04-01), Funk et al.
patent: 4509812 (1985-04-01), Lotter
patent: 4531792 (1985-07-01), Oshitani et al.
patent: 5123855 (1992-06-01), Petersen
patent: 5247250 (1993-09-01), Rios
patent: 5419710 (1995-05-01), Pfaff
patent: 5456613 (1995-10-01), Mc Hugh
Co-Pending Patent Application Serial No. 08/197,437 filed Feb. 16, 1994.
Patent Abstracts of Japan, vol. 9, No. 19 (E-292), 25 Jan. 1985, JP 59-165 442 (Yamaichi).

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