Socket and contact of semiconductor package

Details Socket and contact of semiconductor package Socket and contact of semiconductor package

2006-04-04

2006-04-04

Nasri, Javaid H. (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

Reexamination Certificate

active

07021944

ABSTRACT:
The present invention is directed to a socket connector having a plurality of contacts for contacting with a plurality of solder balls arranged on one of the surface of a semiconductor package, and a socket body in which a plurality of mounting holes are provided for mounting respective contacts. The mounting hole is provided with a through-hole pierced in a height direction of the socket body and a contact support hole of the contact. Each contact is provided with an upright piece extending through the through-hole, and a support piece extending from the upright piece to be inserted into the support hole. A contact portion for contacting with the solder ball is formed at a tip end portion of the upright piece. The support piece extends from the proximal end portion of the upright piece.

REFERENCES:
patent: 5938451 (1999-08-01), Rathburn
patent: 2001-167857 (2001-06-01), None

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