Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2006-01-03
2006-01-03
Hammond, Briggitte R. (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
06981881
ABSTRACT:
The present invention is directed to a socket connector (TS) having a plurality of contacts to be brought into contact with a plurality of solder balls (S) of a semiconductor package, a socket body (15) in which a mounting hole (11) is provided for each contact (10), a through-hole pierced in a height direction of the socket body and a contact support hole (13) are provided. Each contact (10) is provided with an upright piece (101) extending through the through-hole, a support piece extending from a proximal end side of the upright piece to be inserted into the through-hole and a contact portion (103) formed at a free end portion of the upright piece to be brought into contact with the solder ball. Each contact portion is arranged at a height level such that it projects from the surface of the socket body. A guide projection (14) is provided at a position to face an associated contact portion of each contact. These contact portion and guide projection are set at an interval such that the solder ball may be brought into contact with the both.
REFERENCES:
patent: 5324205 (1994-06-01), Ahmad et al.
patent: 5611705 (1997-03-01), Pfaff
Adachi Kiyoshi
Yagi Masanori
Hammond Briggitte R.
Molex Incorporated
Zeitler Robert J.
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