Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-10-09
2007-10-09
Chérvinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S719000, C165S080200, C165S080300, C257S706000, C257S718000, C257S719000
Reexamination Certificate
active
11046452
ABSTRACT:
A ball grid array (BGA) socket is adapted to receive and electrically connect to an integrated circuit disposed between a circuit substrate and a heat sink. An attachment element is adapted to hold the Socket BGA to the circuit substrate with a compressive load isolated from the heat sink.
REFERENCES:
patent: 4414562 (1983-11-01), Kiley et al.
patent: 5702255 (1997-12-01), Murphy et al.
patent: 5772451 (1998-06-01), Dozier et al.
patent: 5833472 (1998-11-01), Bright
patent: 5907474 (1999-05-01), Dolbear
patent: 5985697 (1999-11-01), Chaney et al.
patent: 6084178 (2000-07-01), Cromwell
patent: 6137164 (2000-10-01), Yew et al.
patent: 6164981 (2000-12-01), Lin et al.
patent: 6212070 (2001-04-01), Atwood et al.
patent: 6462271 (2002-10-01), Coffin et al.
patent: 6626691 (2003-09-01), Yu
patent: 6713684 (2004-03-01), Stone
patent: 6724081 (2004-04-01), Ho et al.
patent: 6740820 (2004-05-01), Cheng
patent: 6947293 (2005-09-01), DiBene et al.
patent: 6975518 (2005-12-01), Frutschy et al.
patent: 7095619 (2006-08-01), Panella et al.
patent: 7159313 (2007-01-01), Sathe et al.
patent: 2003/0106710 (2003-06-01), Cheng
patent: 2003/0150645 (2003-08-01), Chiu
patent: 2004/0056298 (2004-03-01), Stone
patent: 2004/0111876 (2004-06-01), Cheng
patent: 2005/0108877 (2005-05-01), Peterson
patent: 2005/0122690 (2005-06-01), Hood et al.
patent: 2006/0198107 (2006-09-01), Azar et al.
patent: 2163287 (1986-02-01), None
Barsun Stephan K.
Malone Christopher G.
Chervinsky Boris
Hewlett--Packard Development Company, L.P.
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