Socket adapted for compressive loading

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S719000, C165S080200, C165S080300, C257S706000, C257S718000, C257S719000

Reexamination Certificate

active

11046452

ABSTRACT:
A ball grid array (BGA) socket is adapted to receive and electrically connect to an integrated circuit disposed between a circuit substrate and a heat sink. An attachment element is adapted to hold the Socket BGA to the circuit substrate with a compressive load isolated from the heat sink.

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