Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1997-01-08
1998-10-06
Nguyen, Khiem
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439331, H01R 909
Patent
active
058168281
ABSTRACT:
A socket (2, 52) for attachment to a printed substrate (10, 60), has a central aperture therethrough. A connective part (3, 53) including a flexible insulative sheet (8, 58) is provided to cover the aperture and act as an electrically connective interface between an electrical part (31, 81) mounted in the socket and the printed substrate. The flexible sheet (8, 58) has a first contact means (5, 55) associated with a first surface of the flexible sheet for electrically connecting with leads (32, 82) of the electrical part and a second contact means (6, 56) associated with a second surface of the flexible sheet for electrically connecting with the printed substrate. An electroconductive member (7, 57) provides electrical connection between the first and second contact means. Such a socket is especially useful for testing electrical parts with high clock speeds and a large number of leads.
REFERENCES:
patent: 5407361 (1995-04-01), Ikeya
U.S. Copending Patent Application Serial No. 08/367,962 based on Japanese Patent Application No. 6-012213 filed Jan. 3, 1995.
U.S. Copending Patent Application Serial No. 08/780,305 based on Japanese Patent Application No.7-43423 filed Feb. 8, 1995.
Ikeya Kiyokazu
Tsuboi Shinji
Baumann Russell E.
Byrd Eugene G.
Donaldson Richard L.
Grossman Rene E.
Nguyen Khiem
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