Snap-on wallplate and heat sink assembly

Electricity: conductors and insulators – Covers or face plates

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C220S241000

Reexamination Certificate

active

06218617

ABSTRACT:

BACKGROUND OF THE INVENTION
Field of the Invention
The invention is directed to wiring devices and more particularly to wallplates and heat sinks for use with such devices.
SUMMARY OF THE INVENTION
An assembly of a wallplate with a heat sink provides a snap-on mounting of a wallplate on the heat-dissipating fins of a heat sink. The heat sink comprises a base upon which are formed a number of heat-dissipating fins, each having a notch at both of its two ends. A wallplate has a body which includes a wall extending along the entire periphery of the back surface of the body. A tab is formed on the inside surface of the wall along a top and bottom portion of the wall. The tabs each terminate in a free end which can lockingly engage the notches at the ends of the heat-dissipating fins to hold the wallplate and heat sink in assembly. The snap-on wallplate can be removed from the heat sink and reinstalled as desired. It is an object of this invention to provide a novel snap-on wallplate and heat sink assembly.
It is an object of this invention to provide a novel snap-on wallplate and heat sink assembly which does not require any additional fixtures to join the wallplate and heat sink.
It is another object of the invention to provide a novel snap-on wallplate and heat sink that uses notches and tabs for assembly of the wallplate to the heat sink.
Other objects and features of the invention will be pointed out in the following description and claims and illustrated in the accompanying drawings, which disclose, by way of example, the principles of the invention and the best mode which is presently contemplated for carrying them out.


REFERENCES:
patent: 3735020 (1973-05-01), Licata
patent: 4737609 (1988-04-01), Yuhasz et al.
patent: 5189259 (1993-02-01), Carson et al.
patent: 5712450 (1998-01-01), Chan et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Snap-on wallplate and heat sink assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Snap-on wallplate and heat sink assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Snap-on wallplate and heat sink assembly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2468413

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.