Snap lid camera module

Details Snap lid camera module Snap lid camera module

2005-08-17

2008-09-16

Thai, Luan (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S433000, C438S048000, C438S054000, C438S064000, C438S069000, C250S239000, C250S216000

Reexamination Certificate

active

07425750

ABSTRACT:
An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place.

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Webster, U.S. Appl. No. 11/706,726, filed Feb. 14, 2007, entitled “Camera Module Fabrication Method Including the Step of Removing a Lens Mount and Window from the Mold”.

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