Snap-in resilient emi grounding clip apparatus for computer stru

Electricity: conductors and insulators – Anti-inductive structures – Conductor transposition

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174 51, 338176, 361816, H05K 900

Patent

active

055324282

ABSTRACT:
To reliably maintain an EMI grounding connection between a sheet metal computer chassis wall and a computer cover wall that may be removably placed against the outer side of the chassis wall, a lance structure is formed in the chassis wall, and opposing installation notches are formed in the chassis wall on opposite sides of the lance opening. Transversely enlarged end portions of an elongated arcuate sheet metal grounding strip are inserted inwardly through the wall notches and captively retained within the lance structure with a longitudinally intermediate portion of the arcuate strip body extending outwardly through the chassis wall lance opening. When the cover wall is operatively installed on the chassis wall the grounding strip is resiliently flattened and compressed between the lance strip and the installed cover wall to maintain an EMI grounding path between the contiguous chassis and cover walls.

REFERENCES:
patent: 3625410 (1971-12-01), Hirschey
patent: 4784265 (1988-11-01), Gitlitz et al.
patent: 5120903 (1992-06-01), Tam
patent: 5225629 (1993-06-01), Garrett
patent: 5313016 (1994-05-01), Brusati et al.

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