Snap fit support housing for a semiconductor power wafer

Details Snap fit support housing for a semiconductor power wafer Snap fit support housing for a semiconductor power wafer

1979-03-06

1981-04-21

James, Andrew J.

357 81, 357 68, H01L 2342, H01L 2344, H01L 2346

Patent

active

042636078

ABSTRACT:
A support housing for a semiconductor wafer which is centered therein between the anode block and the cathode block. It includes two polygonal insulating plates which bear against each of the blocks fitted with notches at 120.degree. to one another in which insulating pins are snap-fitted. In the case of a thyristor, a flexible wire is connected to a contact piece with a spherical end in contact with the trigger of the thyristor by means of a spiral spring. Application to the railway field.

REFERENCES:
patent: 2933663 (1960-04-01), Connell
patent: 3293508 (1966-12-01), Boyer
patent: 3727114 (1973-04-01), Oshima
patent: 3743893 (1973-07-01), Yamomoto
patent: 3808471 (1974-04-01), Grandia
patent: 3972063 (1976-07-01), Kimura et al.
patent: 3992717 (1976-11-01), Rice
patent: 4041523 (1977-08-01), Vogt
IBM Technical Disclosure Bulletin; Grooved Multi-wafer Liquid Cooled Package; Aimi; vol. 17, No. 3, Aug. 1974 p. 655.

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