Sn-Bi alloy-plating bath and plating method using the same

Details Sn-Bi alloy-plating bath and plating method using the same Sn-Bi alloy-plating bath and plating method using the same

1994-11-28

1997-10-07

Gorgos, Kathryn L.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly alloy coating

205253, 106 125, C25D 332

Patent

active

056743742

ABSTRACT:
A Sn--Bi alloy plating bath comprises at least one compound selected from the group consisting of polyoxy monocarboxylic acids, polyoxy lactones, polycarboxylic acids and salts thereof. A plating method comprises the step of applying a Sn--Bi alloy plating film to a substrate in the foregoing plating bath. The plating bath permits the formation of a Sn--Bi alloy plating film having a bismuth content ranging from 0.1 to 75% over a wide current density range. Moreover, the plating bath never forms precipitates, does not become turbid, does not cause any change of the bath composition and is, therefore, quite stable even when it is stored over a long period of time.

REFERENCES:
patent: 3616291 (1971-10-01), Wilson
patent: 4162205 (1979-07-01), Wilson et al.
patent: 4163700 (1979-08-01), Igarashi et al.
Protection of Metals, vol. 25, No. 4, Jul./Aug. 1989, pp. 532-533, G.A. Kurnoskin, et al., "A Citrate Electrolyte for Deposition of Tin-bismuth Coatings".
Surface Treatment Technology Abstacts, vol. 28, No. 2, Mar./Apr. 1986, p. 72, I.N. Sorokin, et al., "Electrodeposition of Sn-Bi Alloy".
Database WPI, Derwent Publications, Week 9302, Mar. 3, 1993, AN-93-016064/02, SU-1712469, Oct. 31, 1989.

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