Sn-Bi alloy-plating bath and method for forming plated Sn-Bi all

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly alloy coating

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205254, 106 125, C25D 332

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active

057593817

ABSTRACT:
An Sn--Bi alloy-plating bath comprises (i) Bi ions, (ii) Sn ions, (iii) ions of one metal selected from the group consisting of Cu, Co and Ag, and (iv) one member selected from the group consisting of carboxylic acids, lactone compounds, alkanesulfonic acids, alkanolsulfonic aicds, phenolsulfonic acids and salts thereof and is substantially free of lead ions. The bath permits the formation of an Sn--Bi alloy-plated film, does not form any plated film having impaired quality even at a temperature higher than about 100.degree. C. and does not form any whisker.

REFERENCES:
patent: 5039576 (1991-08-01), Wilson
patent: 5296128 (1994-03-01), Gernon et al.
Database WPI, Dertwent Publications, AN 86-143337, SU-A 1 191 492, Nov. 15, 1985.
Database WPI, Derwent Publications, AN 78-16585, JP-A 53 005 034, Jan. 18, 1978.

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