SMT-type structure of the silicon-based electret condenser...

Details SMT-type structure of the silicon-based electret condenser... SMT-type structure of the silicon-based electret condenser...

2005-03-22

2005-03-22

Kuntz, Curtis (Department: 2643)

Electrical audio signal processing systems and devices

Electro-acoustic audio transducer

Microphone capsule only

C381S191000, C307S400000, C367S170000

Reexamination Certificate

active

06870939

ABSTRACT:
This invention mainly provides a SMT-type structure of the minimized and low-power silicon-based electret condenser microphone. Primarily integrates with the electret, silicon-based, MEMS and microphone techniques to implement the minimized and low-power silicon-based electret condenser microphone. The Silicon-based bi-diaphragm of the composite diaphragm-chip was coated with the low-dielectric macromolecule material to allow the microphone acquires the sufficient electrical charges. Moreover, the impedance matching element of the microphone that MOSFET was implemented by the MEMS technology. Conclusively, this silicon-based electret condenser microphone gains several achievements as the smallest volume, a lower bias voltage, a SMT-type structure, a lower residue stress and a lower assembly cost.

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patent: 2002081740 (2001-04-01), None

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