Smooth pads for CMP and polishing substrates

Details Smooth pads for CMP and polishing substrates Smooth pads for CMP and polishing substrates

2006-10-10

2006-10-10

Morgan, Eileen P. (Department: 3723)

Abrading

Abrading process

With tool treating or forming

C451S443000, C451S028000

Reexamination Certificate

active

07118461

ABSTRACT:
Pads and methods of making the pads for applications such as polishing substrates and chemical mechanical planarization of substrates are provided. The pads include a substantially smooth surface for improved performance.

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