Smooth board and process for preparing a smooth board

Details Smooth board and process for preparing a smooth board Smooth board and process for preparing a smooth board

2004-08-18

2008-08-12

Sellers, Robert (Department: 1796)

Coating processes

With post-treatment of coating or coating material

Heating or drying

C427S340000, C427S341000, C427S355000, C427S379000, C525S485000, C525S486000, C525S524000, C525S525000, C525S526000

Reexamination Certificate

active

07410673

ABSTRACT:
The thermosetting resin composition which is valuable for an undercoat of a printed wiring board, and does not leave an air bubble in a cured film, and makes the surface polishing easy and can form a smooth printed wiring board comprises (I) an adduct of epoxy resin with unsaturated aliphatic acid, (II) a (meth) acrylate, (III) a radical polymerization initiator, (IV) a crystallizable epoxy resin, and (V) a latent curing agent.

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