SMD chip handling apparatus

Details SMD chip handling apparatus SMD chip handling apparatus

2008-03-04

2008-03-04

Trinh, Minh (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S740000, C029S741000, C029S744000, C029S840000, C228S180210, C228S041000

Reexamination Certificate

active

11100585

ABSTRACT:
The apparatus is for securely fetching and positioning an SMD chip on a printed circuit board and soldering the same to the board. Two spring plates form the clasping fingers which are wedged apart to a width larger than the width of the SMD chip by an expander formed on an elongated rod slidably mounted within a vertical tubular housing. An SMD chip may be safely fetched by pressing the rod on the top of the SMD with a continuous depressing motion until the fingers clasp the SMD chip safely therebetween. A soldering unit with a bifurcate soldering head located juxtaposed to the fingers is operative to solder the SMD chip to the printed circuit board while the SMD chip is safely held in place.

REFERENCES:
patent: 4759124 (1988-07-01), Snyder et al.
patent: 4858974 (1989-08-01), Stannek
patent: 4860438 (1989-08-01), Chen
patent: 5193269 (1993-03-01), Dattilo
patent: 5199151 (1993-04-01), Wentworth et al.
patent: 5977512 (1999-11-01), Azdasht et al.
patent: 5992725 (1999-11-01), Egawa et al.
patent: 6915940 (2005-07-01), Zakel et al.

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