Smart microwave packaging structures

Details Smart microwave packaging structures Smart microwave packaging structures

1995-09-15

1999-01-26

Leung, Philip H.

Electric heating

Microwave heating

Cookware

219730, 426107, 426234, 99DIG14, H05B 680

Patent

active

058641238

ABSTRACT:
Active elements are described which modify the heating of foodstuffs and other microwave-heatable loads and which are responsive to changes of load dielectric properties with temperature or as a result of changes of state, composition or density during heating, to the presence of absence of loads, and to the presence or absence of adjacent dielectric materials. The active elements, which may be looped slots or strips, are constituted so as to be or become resonant or non-resonant during microwave heating of the load in response to the presence or absence of the load or the presence or absence of adjacent dielectric material. The elements conveniently may be constructed of electroconductive metal or artificial dielectric material.

REFERENCES:
patent: 4814568 (1989-03-01), Keefer
patent: 4990735 (1991-02-01), Lorenson et al.
patent: 5117078 (1992-05-01), Beckett
patent: 5260537 (1993-11-01), Beckett
patent: 5354973 (1994-10-01), Beckett
patent: 5412187 (1995-05-01), Walters et al.
patent: 5519195 (1996-05-01), Keefer et al.

Affiliated with

Also associated with

Rating

Smart microwave packaging structures does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Smart microwave packaging structures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Smart microwave packaging structures will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1451956