Smart cards having thin die

Details Smart cards having thin die Smart cards having thin die

1996-04-19

1998-02-17

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

257669, 257672, 257728, 257782, H01C 2302, H01C 23495, H01C 2334

Patent

active

057194378

ABSTRACT:
Thin semiconductor die, approximately 0.004 to 0.007 inches thick, are positioned substantially on the neutral plane of a smart card, the neutral plane defined as the plane of substantially no mechanical strain during flexure of the smart card, thereby providing smart cards having improved resistance to mechanical flexure, and/or smart cards having improved RF performance.

REFERENCES:
patent: 5163728 (1992-11-01), Miller et al.
patent: 5480842 (1996-01-01), Clifton et al.
patent: 5489637 (1996-02-01), Nguyen et al.
patent: 5546275 (1996-08-01), Moutrie et al.
patent: 5561328 (1996-10-01), Massingill et al.

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