Smart cards having glue-positioned electronic components

Details Smart cards having glue-positioned electronic components Smart cards having glue-positioned electronic components

1998-10-21

2000-02-15

Raimund, Christopher

Stock material or miscellaneous articles

Structurally defined web or sheet

Laterally noncoextensive components

235488, 235492, 235487, G06K 1902

Patent

active

060250542

ABSTRACT:
Smart cards having high quality external surfaces can be made through the use of partially cured, low shrinkage glues to hold the smart card's electronic elements during their immersion in a thermosetting material that becomes the core layer of said cards. Mounds of low shrinkages give serve to hold the electronic component in a given position in the core layer.

REFERENCES:
patent: 4339407 (1982-07-01), Leighton
patent: 4961893 (1990-10-01), Rose
patent: 5164144 (1992-11-01), Rose
patent: 5350553 (1994-09-01), Glaser et al.
patent: 5399847 (1995-03-01), Droz
patent: 5417905 (1995-05-01), Lemaire et al.
patent: 5423705 (1995-06-01), Solomon, III
patent: 5498388 (1996-03-01), Kodai et al.
patent: 5510074 (1996-04-01), Rose

Affiliated with

Also associated with

Rating

Smart cards having glue-positioned electronic components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Smart cards having glue-positioned electronic components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Smart cards having glue-positioned electronic components will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1904190