Small size sputtering target and high vacuum sputtering apparatu

Details Small size sputtering target and high vacuum sputtering apparatu Small size sputtering target and high vacuum sputtering apparatu

1996-07-12

1998-05-19

Weisstuch, Aaron

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20419212, 2042982, C23C 1434

Patent

active

057530904

ABSTRACT:
A high vacuum sputtering apparatus comprising a vacuum chamber in which a substrate to be processed and a small size sputtering target having an outer diameter less than one and a half times the diameter of the substrate and an area inclined toward the outer periphery thereof on the surface disposed opposite to the substrate are oppositely disposed, and the internal pressure of the vacuum chamber is maintained at less than 1.times.10.sup.-3 Torr for sputtering, thereby obtaining an improved distribution of film thickness and an enhanced coverage symmetry for sputtering.

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